www.德州仪器.com
特性
3
2
4
61
一个 C
Y
地
B
dbv pACKAGE
(t运算 视图)
yep 或者 yzp pACKAGE
(bottom 视图)
dck pACKAGE
(t运算 视图)
3
2
4
61
一个 C
Y
地
B
一个
B
C
Y
地
看 机械的 绘画 为 维度.
1
4
2
3
6
V
CC
V
CC
5
V
CC
5
5
描述/orderinginformation
SN74LVC1G3208
single3-inputpositiveor-andgate
SCES605A–SEPTEMBER2004–REVISEDJUNE2005
•
canbeusedinthreecombinations:
•
availableinthetexasinstruments–or-andgate
NanoStar™andNanoFree™Packages
–ORGate
•
supports5-vv
CC
运作
–ANDGate
•
inputsacceptvoltagesto5.5v
•
I
止
supportspartial-电源-downmode
•
Maxt
pd
of5nsat3.3voperation
•
lowpowerconsumption,10-
µ
AMaxI
CC
•
获得-upperformanceexceeds100maper
jesd78,classii
•±
24-maoutputdriveat3.3v
•
ESDProtectionExceedsJESD22
•
InputHysteresisAllowsSlowInputTransition
andbetterswitchingnoiseimmunityatthe–2000-vhuman-bodymodel(a114-一个)
输入
–200-vmachinemodel(a115-一个)
(v
hys
=250mvtyp@3.3v)
–1000-vcharged-devicemodel(c101)
thisdeviceisdesignedfor1.65-vto5.5-vv
CC
运作.
thesn74lvc1g3208isasingle3-inputpositiveor-andgate.itperformsthebooleanfunctiony=(a+b)
⋅
C
inpositivelogic.
ORDERINGINFORMATION
T
一个
包装
(1)
orderablepartnumbertop-sidemarking
(2)
nanostar™–wcsp(dsbga)
SN74LVC1G3208YEPR
0.23-mmlargebump–yep
reelof3000___dd_
nanofree™–wcsp(dsbga)
0.23-mmlargebump–yzpsn74lvc1g3208yzpr
(铅-自由)
–40
°
Cto85
°
C
Reelof3000SN74LVC1G3208DBVR
sot(sot-23)–dbvcdd_
Reelof250SN74LVC1G3208DBVT
Reelof3000SN74LVC1G3208DCKR
sot(sc-70)–dckdd_
Reelof250SN74LVC1G3208DCKT
(1)packagedrawings,standardpackingquantities,thermaldata,符号化,andpcbdesignguidelinesareavailableat
www.德州仪器.com/sc/包装.
(2)dbv/dck:theactualtop-sidemarkinghasoneadditionalcharacterthatdesignatestheassembly/testsite.
yep/yzp:theactualtop-sidemarkinghasthreeprecedingcharacterstodenoteyear,month,andsequencecode,andonefollowing
charactertodesignatetheassembly/testsite.pin1identifierindicatessolder-bumpcomposition(1=snpb,
⋅
=铅-自由).
pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsoftexas
instrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet.
nanostar,nanofreearetrademarksoftexasinstruments.
productiondatainformationiscurrentasofpublicationdate.
copyright©2004–2005,texasinstrumentsincorporated
ProductsconformtospecificationsperthetermsoftheTexas
instrumentsstandardwarranty.productionprocessingdoesnot
necessarilyincludetestingofallparameters.