eds2532eebh-75
初步的 数据 薄板 e0639e50 (ver. 5.0)
3
内容
描述.....................................................................................................................................................1
特性.........................................................................................................................................................1
管脚 configurations .........................................................................................................................................1
订货 在formation......................................................................................................................................2
部分 number ..................................................................................................................................................2
电的 specifications.................................................................................................................................4
块 图解 ...............................................................................................................................................9
管脚 函数.................................................................................................................................................10
command operation ...................................................................................................................................12
simplified state diagram.............................................................................................................................21
模式 寄存器 和 扩展 模式寄存器 configuration.......................................................................22
电源-向上sequence.....................................................................................................................................24
运作 的 这 sDRAM.............................................................................................................................25
定时 波形式.......................................................................................................................................41
包装 drawing ........................................................................................................................................47
推荐 焊盘ing 情况..........................................................................................................48
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