©2002 仙童 半导体 公司 hufa76645p3, hufa76645s3s rev. b
额外的刺激 热的 模型
rev 7 六月 1999
HUFA76645T
ctherm1 th 6 6.4e-3
ctherm2 6 5 3.0e-2
ctherm3 5 4 1.4e-2
ctherm4 4 3 1.6e-2
ctherm5 3 2 5.5e-2
ctherm6 2 tl 1.5
rtherm1 th 6 3.4e-3
rtherm2 6 5 8.6e-3
rtherm3 5 4 2.3e-2
rtherm4 4 3 1.3e-1
rtherm5 3 2 1.8e-1
rtherm6 2 tl 3.9e-2
saber 热的 模型
saber 热的 模型 hufa76645t
template 热的_模型 th tl
热的_c th, tl
{
ctherm.ctherm1 th 6 = 6.4e-3
ctherm.ctherm2 6 5 = 3.0e-2
ctherm.ctherm3 5 4 = 1.4e-2
ctherm.ctherm4 4 3 = 1.6e-2
ctherm.ctherm5 3 2 = 5.5e-2
ctherm.ctherm6 2 tl = 1.5
rtherm.rtherm1 th 6 = 3.4e-3
rtherm.rtherm2 6 5 = 8.6e-3
rtherm.rtherm3 5 4 = 2.3e-2
rtherm.rtherm4 4 3 = 1.3e-1
rtherm.rtherm5 3 2 = 1.8e-1
rtherm.rtherm6 2 tl = 3.9e-2
}
RTHERM4
RTHERM6
RTHERM5
RTHERM3
RTHERM2
RTHERM1
CTHERM4
CTHERM6
CTHERM5
CTHERM3
CTHERM2
CTHERM1
tl
2
3
4
5
6
th
接合面
情况
hufa76645p3, hufa76645s3s
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